|Program name||Package id||Status||Status date|
|Package ID||Orig. computer||Test computer|
|NEA-1327/06||PC Windows,HP W.S.||HP 9000,PC Pentium|
CAPCAL is devoted to the calculation of capacitances of three-dimensional wiring configurations are typically used in VLSI circuits. Due to analogies in the mathematical description, also conductance and heat transport problems can be treated by CAPCAL. To handle the problem using CAPCAL same approximations have to be applied to the structure under investigation:
the overall geometry has to be confined to a finite domain by using symmetry-properties of the problem
Non-rectangular structures have to be simplified into an artwork of multiple boxes.
Certain restrictions of use may arise from the dimensioning of arrays. Field lengths are defined via PARAMETER-statements which can easily by modified. If the geometry of the problem is defined such that Neumann boundaries are dominating the convergence of the iterative equation system solver is affected.
Strongly depending on problem-size. Around 1 hour on a 1 MIPS machine.
The following Table displays the CPU (elapsed) time necessary to run the main processor CAP2 on each of the three sample problems on the VAX 6000-510 machine (running VMS) and on the DEC 3000 Model 300 X (ALPHA AXP architecture workstation running OSF/1).
Sample Problem (filename)
|Package ID||Status date||Status|
|NEA-1327/06||06-OCT-2004||Tested at NEADB|
A. Seidl et al.: IEEE Trans. CAD, Vol.7, No.5 (May 1988).
H. Klose et al.: Proceedings of the 1988 International Electronic Devices and Materials Symposium National Sun Yat-sen University Kaohsiung, Taiwan, R.O.C.
VAX or any other machine running a FORTRAN-77 compiler
REGIS or other graphics terminal
The test cases were run at the NEA-DB on both DEC VAX-6000 and an ALPHA/OSF workstation.
COMPUTER : HP 9000/800 rp5405 Bi-Processor 650MHz
OPERATING SYSTEM : HP-UX B.11.11
COMPUTER : NEC Powermate CT Intel Pentium III 800MHz; IBM T40 Intel Centrino 1300MHz
OPERATING SYSTEM : MS WINDOWS 2000 Professional (US Version); MS Windows XP Professional (German Version)
Keywords: VLSI, electronic circuits, heat, three-dimensional.